A focused route for engineering teams that need to see and assess hidden BGA solder joints without removing the package.
Target customers
- BGA assembly manufacturers
- electronics reliability engineers
- failure analysis teams
Inspection questions
- Where are voids or bridges located within the BGA solder array?
- What image measurements can support solder joint analysis?
Capability boundary
- Image interpretation depends on package geometry, board stack-up, contrast, magnification, and the acceptance method defined by the customer.
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Continue with technical knowledge
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