Electronics Manufacturing
Review BGA bridges, cold solder joints, voids, opens, and insufficient solder with non-destructive imaging and measurement.
Review the solution → INDUSTRIAL MICROFOCUS X-RAY INSPECTION
Industrial Microfocus X-Ray InspectionSolutions for Measurable Evidence
Non-destructive inspection and measurable image evidence for electronics manufacturing and industrial defect analysis.
5μmMinimum focal spot
100kVX-ray source voltage
850mmPCB rail width
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INSPECTION PATHS FOR MANUFACTURING
PRODUCT MATRIX
Industrial X-Ray inspection across core manufacturing tasks
From electronics failure analysis to SMT X-Ray Inspection and PCB Inspection, component counting, and casting analysis, VMAX connects image evidence with measurable engineering review.
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XST 6800 General Electronics X-Ray Inspection System
A high-resolution offline system for BGA, solder joint, and electronic component inspection, with programmable image capture, measurement, and image analysis.
- 100 kV X-ray source, 5 μm focal spot, and automatic tube sleep protection
- 560 × 530 mm sample size and 5 kg maximum sample weight
- 200× geometric magnification, 2000× system magnification, and receiver support for 60° angled inspection
TUBE VOLTAGE100 kV
FOCAL SPOT5 μm
INDUSTRY SOLUTIONS
Inspection paths for different manufacturing contexts
Connect the X-ray source, flat-panel detector, motion platform, measurement software, and data interface to the sample and inspection workflow.
Semiconductor Package Inspection
Review wire bonds, broken wires, die attach, and package structures for incoming inspection and failure analysis.
Review the solution →Automotive Electronics
Inspect electronic assemblies and cast components used in automotive production for hidden structural evidence.
Review the solution →Casting and Industrial Defect Analysis
Review porosity, inclusions, cracks, and other internal indications in castings and industrial components.
Review the solution →VOID 08.6%
REAL-TIME AI ANALYSIS ACTIVE
CORE TECHNOLOGY
From visible images to measurable, traceable evidence
Integrate X-ray imaging, automatic navigation, programmed acquisition, dimensional measurement, defect analysis, and data reporting in one inspection workflow.
01
High-resolution imaging chain
Microfocus X-ray sources and high-definition flat-panel detectors support inspection of hidden structures and solder joints.
02
Image processing and measurement
Support automatic navigation, BGA void measurement, solder analysis, defect review, and exposure enhancement.
03
Automation and data continuity
Connect loading, code reading, marking, SPC statistics, image storage, and MES result reporting where required.
BUILT FOR INDUSTRY
Professional inspection for engineering decisions
VMAX focuses on industrial X-ray inspection equipment and visual engineering solutions for electronics, semiconductor, battery, automotive casting, and industrial applications.
5μmMinimum focal spot
225kVOptional maximum tube voltage
≤0.5μSv/hRadiation leakage indicator
APPLICATION CASES
Typical inspection tasks
PCBA / SMT
BGA bridges, cold solder, voids, and opens
Connect geometric magnification, automatic navigation, and BGA void measurement with printing, reflow, and rework review.
Review the case →SEMICONDUCTOR
Wire bond inspection inside IC packages
Review wire paths, broken wires, sagging wires, and bond area structures without dismantling the package.
Review the case →EV BATTERY
Porosity and internal structure in cast components
Record internal casting evidence and geometry-related indications for quality control and engineering assessment.
Review the case → X-RAY APPLICATION LAB
Technical Application Library
Review practical X-ray inspection questions, measurable observations, and engineering guidance across electronics manufacturing and industrial components.
Browse technical applications ↗TECHNICAL APPLICATIONPUBLISHED
VMAX X-Ray Analysis
BGA Bridge Inspection with X-Ray Imaging
BGA bridge inspection uses X-ray image evidence to review adjacent solder joints that are hidden by the package body during optical inspection and supports solder joint analysis.
Inspection focusBGA bridge inspection · X-ray inspection · solder joint analysis
Read the technical application →TECHNICAL APPLICATIONPUBLISHED
VMAX X-Ray Analysis
BGA Void Inspection Using Industrial X-Ray
Industrial X-ray imaging helps engineers assess solder joint void distribution, measurement repeatability, and process-related inspection questions without dismantling the package.
Inspection focusBGA void inspection · X-ray inspection · solder joint analysis
Read the technical application →TECHNICAL APPLICATIONPUBLISHED
VMAX X-Ray Analysis
Casting Porosity Inspection with Industrial X-Ray
Casting porosity inspection uses X-ray image evidence to review low-density indications in die-cast and industrial cast components as part of industrial defect analysis.
Inspection focuscasting porosity inspection · X-ray inspection · industrial defect analysis
Read the technical application →TECHNICAL APPLICATIONPUBLISHED
VMAX X-Ray Analysis
Casting Shrinkage Inspection Using X-Ray and CT
Casting shrinkage inspection supports non-destructive review of low-density indications and their relationship to critical functional regions during industrial defect analysis.
Inspection focuscasting shrinkage inspection · X-ray inspection · industrial defect analysis
Read the technical application →TECHNICAL APPLICATIONPUBLISHED
VMAX X-Ray Analysis
QFN Insufficient Solder Inspection Using X-Ray
Industrial X-ray inspection helps engineers review hidden QFN solder coverage when the center pad and surrounding joints cannot be assessed optically, supporting solder joint analysis.
Inspection focusQFN insufficient solder · X-ray inspection · solder joint analysis
Read the technical application →TECHNICAL APPLICATIONPUBLISHED
VMAX X-Ray Analysis
QFN Void Inspection for Hidden Solder Joints
QFN void inspection focuses on hidden center-pad solder structures where optical inspection cannot directly show internal void distribution, supporting solder joint analysis.
Inspection focusQFN void inspection · X-ray inspection · solder joint analysis
Read the technical application → START YOUR PROJECT
Define the next
industrial X-Ray inspection path
Share the sample type, dimensions, inspection target, cycle time, and data interface requirements so the VMAX team can discuss a suitable inspection approach.