Support SMT process review with non-destructive images of solder joints and other hidden assembly structures.
Target customers
- SMT production lines
- PCB assembly engineers
- process and quality teams
Inspection questions
- Are solder joints formed as expected beneath the package?
- Can voids, bridges, or insufficient solder be reviewed with repeatable image evidence?
Capability boundary
- X-ray evidence supports engineering review but does not replace process records, acceptance criteria, or destructive validation where required.
Related products
Related technical applications
Continue with technical knowledge
Describe the package, board, defect type, and inspection workflow for a technical discussion. →