A capability-based comparison of optical and X-ray inspection for electronics manufacturing decisions.
What AOI can show
AOI evaluates visible surfaces and can support checks of component presence, placement, marking, and accessible solder features.
What X-ray can add
X-ray inspection can provide evidence about hidden solder joints, package interfaces, voids, and other internal structures that optical views cannot directly access.
How to choose a workflow
Many production teams use optical and X-ray methods for different questions. The decision should follow the defect mode, sampling plan, throughput, and required evidence.
Capability boundary
- Neither AOI nor X-ray inspection is universally superior. Visibility, resolution, cycle time, access, acceptance criteria, and the target defect determine which method is appropriate.